PCB Assembly

China PCBA Manufacturer

Expert PCB Assembly Services in China – Quality, Speed, and Reliability You Can Trust.

Laser Stencil

Laser cutting stainless steel stencils, specially designed for automatic solder paste printing.

SMT + Reflow

Fuji NXT III + AIMEX + XPF SMT mounter; Lead-free 12 Heating zones Nitrogen Reflow Oven.

DIP + Wave

Manual or automatic insertion, wave soldering; Post-welding; Senju solder paste.

SMT + DIP Mixed

Combine of both through-hole and surface-mount technology components on the same PCBA.

Lead-free Assembly

RoHS components, lead-free solder paste for safer, eco-friendly electronics.

IC Programming

Loading firmware, software code and configuration data into programmable ICs.

BGA Rework

Removing and replacing the BGA component from PCBA and fix it.

Conformal Coating

A thin polymer film on the PCB for protection against moisture and harsh conditions.

Injection Molding

Make the plastic or metal enclosure for the PCBA, use mould.

Functional testing

Software testing that verifies the software performs its intended functions according to requirements.

Cable & Wire harness

Hand or automatic soldering the high quality cables, wire harness onto the PCB.

Ageing Test

Evaluate a system's performance over time to identify potential long-term issues.

Box Build

Assembling, configuring, and testing electronic devices or systems in packaging.

PCBA Test & Inspections

Visual + AOI, X-ray inspections; ICT, FCT, Aging testing...

Kitted Assembly

Assembling, configuring, and testing electronic devices or systems in packaging.

Turnkey PCB Assembly

From bare PCB Manufacturing to the finished product for sale on market.

Value-Added Services

Our value-added services are designed to enhance your experience and provide additional benefits beyond our core offerings. From quality guarantees to personalized support, we are committed to going the extra mile to ensure your complete satisfaction.

Free DFM Check

Free DFM analysis to Ensure the PCB design is optimized for assembly, reducing errors and improving yield rates.

Mixed Technology Assembly (SMT + THT)

Support both Surface Mount Technology (SMT) and Through-Hole Technology (THT) for complex or hybrid PCB designs.

Quick turn PCB Assembly

Expedited assembly services to meet tight deadlines, ideal for prototyping or urgent production needs.

Turnkey PCB Solution

Comprehensive end-to-end service covering PCB fabrication, component sourcing, assembly, and testing, providing a seamless experience for customers.

PCB Assembly Processes

1

IQC

Check all the data provided to make sure the designing of the PCB is manufacturable, functional, reliable and cost effective. Raise questions if EQ, then issue MI for production.

2

Incoming Storage

Cut the materials into panel according to MI. Including core, Prepreg, copper foils. Tooling holes need to be drilled at this step.

3

Material Preparation

Prepare for the inner layer DFR(Dry Film Resist) lamination. To increase DFR adhesion, etch the surface of copper foils by jet-scrubber, buffbrushing.

4

IPQC

Laminate Dry Film on cores. D/F is used as a photosensitive material forphotolithography.

5

Solder Paste Printing

Expose light onto the D/F.LDI (Laser Direct Imaging),which doesn't require mask application,is analternative solution.

6

SPI

Same as the following. Developing the photoresist; Etching away unwanted copper; Stripping the remaining resist to reveal the circuit pattern.

7

PCB Conveying

Etch the surface of copper surface to ensure adhesion of coppe and Prepreg.

8

SMD Placement

Laminate copper foils, Prepreg and black oxided cores to a single panel.

9

Placement Inspection

Heat the laminated layers under pressure in a vacuum melt Prepreg by heat to multilayer PCB formation. Other processes by the following will be the same as a double-sided PCB.

10

Reflow Soldering

Drill on board to form through holes.

11

First Article Inspection

Remove the smear and resin residues left in the drilled holes, to ensure good electrical connectivity and improve the copper plating quality.

12

AOI

Remove the smear and resin residues left in the drilled holes, to ensure good electrical connectivity and improve the copper plating quality.

13

X-Ray Inspection

Electroless Copper Plating, a thin layer of copper is deposited on the hole walls through a chemical process, making them conductive.

14

Visual Inspection

Electroplating, the thin copper layer is further reinforced with additional copper through electroplating, ensuring robust andreliable electrical connections.

15

DIP Soldering

Prepare for the next step, D/F lamination. To increase dry film adhesion, etch the surface of copper foils by jet-scrubber,buff brushing.

16

Visual Inspection

Laminate Dry Film on copper foils. D/F is used as a photosensitive material for photolithography.

17

Functional Testing

Apply masks(films) on D/F and expose light onto the surface of copper foils. Currently, we use both ways, D/Fand LDI(Laser Direct Imaging), which doesn't require mask application.

18

FQC

Developing the photoresist; Etching away unwanted copper; Stripping the remaining resist to reveal the circuit pattern.

19

Packing

Use AOI for outer layer inspection, to check for defects such as scratches, misalignments, and incomplete etching, ensuring the final board meets the required specification.

20

PCBA Storage

Clean and roughen the copper surface to increase the adhesion between the copper surface and solder resist.

21

Shipping

Apply photosolder resist on one side then pre-baking, then printing solder resist on the other side, pre-baking, then exposure-develop-curing.

Key Manufacturing Equipment

Typical SMT line

General PCBA Specification

No. Item Feature Standard Advanced
No. 1
Item Layer Count
Feature Min~Max
Standard 1~16L
Advanced 48 L(Max.)
No. 2
Item Material
Feature Types
Standard FR-4, Aluminum/ Copper-base, Rogers
Advanced FR-4(Halogen-free), Arlon
No. 3
Item Panel Size
Feature Max
Standard 508 x 610 mm(20”x 24”)
Advanced 508 x 1500 mm(20” x 34”)
No. 4
Item Finished Thickness
Feature Min~max
Standard 0.2~5.0mm(0.005~0.126”)
Advanced 0.2~6.5mm(0.005~0.165”)
No. 5
Item Trace Width/ Space
Feature Inner/ Outer layer
Standard 3/3mils(0.075/0.075mm)
Advanced 2/2mils(0.05/0.05mm)
No. 6
Item Mechanical Drilling
Feature Min
Standard 0.008”(0.20mm)
Advanced 0.006”(0.15mm)
No. 7
Item Mechanical Drilling
Feature Max
Standard 0.197”(5.0mm)
Advanced 0.256”(6.5mm)
No. 8
Item Laser Drilling
Feature Min
Standard 0.006”(0.15mm)
Advanced 0.004”(0.10mm)
No. 9
Item Aspect Ratio
Feature Max
Standard 12:1
Advanced 20:1
No. 10
Item Copper Thickness
Feature Min~max
Standard 0.5~6 OZ
Advanced 20 OZ(max)
No. 11
Item Solder Mask
Feature Color
Standard Glossy/Matt Green, white, black, red, blue
Advanced Yellow, pink, purple
No. 12
Item Silkscreen
Feature Color
Standard White, black
Advanced /
No. 13
Item Surface Finish
Feature Types
Standard HASL, Immersion Gold/ Tin/ Silver, Plating hard Gold, OSP
Advanced ENEPIG
No. 14
Item Routing
Feature Bit diameter
Standard 0.093”, 0.062”, 0.031”
Advanced 0.021”
No. 15
Item Profile
Feature Tolerance
Standard ±0.006”(0.15mm)
Advanced ±0.004”(0.10mm)
No. 16
Item V-scoring
Feature Angle
Standard 30°
Advanced 20°/ 45°/ 60°
No. 17
Item Plating Hard Gold
Feature Thickness
Standard 0.032”(0.8um) typical
Advanced 0.050”(max)
No. 18
Item Special Processes
Feature /
Standard Carbon Ink, Peelable Mask, depth controll milling
Advanced /

Our Certifications

Related IPC Standards

Guidelines and specifications used in the electronics manufacturing industry to ensure the quality, reliability, and consistency of electronic products.

PCB Acceptance