Union Circuits focus on quick turnaround prototype, small to medium PCBA manufacturing.
Laser cutting stainless steel stencils, specially designed for automatic solder paste printing.
Fuji NXT III + AIMEX + XPF SMT mounter; Lead-free 12 Heating zones Nitrogen Reflow Oven.
Manual or automatic insertion, wave soldering; Post-welding; Senju solder paste.
Combine of both through-hole and surface-mount technology components on the same PCBA.
RoHS components, lead-free solder paste for safer, eco-friendly electronics.
Loading firmware, software code and configuration data into programmable ICs.
Removing and replacing the BGA component from PCBA and fix it.
A thin polymer film on the PCB for protection against moisture and harsh conditions.
Make the plastic or metal enclosure for the PCBA, use mould.
Software testing that verifies the software performs its intended functions according to requirements.
Hand or automatic soldering the high quality cables, wire harness onto the PCB.
Evaluate a system's performance over time to identify potential long-term issues.
Assembling, configuring, and testing electronic devices or systems in packaging.
Visual + AOI, X-ray inspections; ICT, FCT, Aging testing...
Assembling, configuring, and testing electronic devices or systems in packaging.
From bare PCB Manufacturing to the finished product for sale on market.
Our value-added services are designed to enhance your experience and provide additional benefits beyond our core offerings. From quality guarantees to personalized support, we are committed to going the extra mile to ensure your complete satisfaction.
Ensure the PCB design meets specific manufacturability criteria before going into production, aim to identify potential issues that could affect manufacturing efficiency, quality, and costs.
For prototypes, small batches, and applications where speed is crucial, our quickturn services can significantly reduce your lead time from design to finished product.
High Mix Low Volume PCB production, offering a wide variety of PCBs in small quantities, tailored to meet your specific needs.
Analyzing and recreating the layout and function of a PCB from real PCB sample to understand its design, components, and functionality.
Check all the data provided to make sure the designing of the PCB is manufacturable, functional, reliable and cost effective. Raise questions if EQ, then issue MI for production.
Cut the materials into panel according to MI. Including core, Prepreg, copper foils. Tooling holes need to be drilled at this step.
Prepare for the inner layer DFR(Dry Film Resist) lamination. To increase DFR adhesion, etch the surface of copper foils by jet-scrubber, buffbrushing.
Laminate Dry Film on cores. D/F is used as a photosensitive material forphotolithography.
Expose light onto the D/F.LDI (Laser Direct Imaging),which doesn't require mask application,is analternative solution.
Same as the following. Developing the photoresist; Etching away unwanted copper; Stripping the remaining resist to reveal the circuit pattern.
Etch the surface of copper surface to ensure adhesion of coppe and Prepreg.
Laminate copper foils, Prepreg and black oxided cores to a single panel.
Heat the laminated layers under pressure in a vacuum melt Prepreg by heat to multilayer PCB formation. Other processes by the following will be the same as a double-sided PCB.
Drill on board to form through holes.
Remove the smear and resin residues left in the drilled holes, to ensure good electrical connectivity and improve the copper plating quality.
Remove the smear and resin residues left in the drilled holes, to ensure good electrical connectivity and improve the copper plating quality.
Electroless Copper Plating, a thin layer of copper is deposited on the hole walls through a chemical process, making them conductive.
Electroplating, the thin copper layer is further reinforced with additional copper through electroplating, ensuring robust andreliable electrical connections.
Prepare for the next step, D/F lamination. To increase dry film adhesion, etch the surface of copper foils by jet-scrubber,buff brushing.
Laminate Dry Film on copper foils. D/F is used as a photosensitive material for photolithography.
Apply masks(films) on D/F and expose light onto the surface of copper foils. Currently, we use both ways, D/Fand LDI(Laser Direct Imaging), which doesn't require mask application.
Developing the photoresist; Etching away unwanted copper; Stripping the remaining resist to reveal the circuit pattern.
Use AOI for outer layer inspection, to check for defects such as scratches, misalignments, and incomplete etching, ensuring the final board meets the required specification.
Clean and roughen the copper surface to increase the adhesion between the copper surface and solder resist.
Apply photosolder resist on one side then pre-baking, then printing solder resist on the other side, pre-baking, then exposure-develop-curing.
| No. | Item | Feature | Standard | Advanced |
|---|---|---|---|---|
| 1 | Layer Count | Min~Max | 1~16L | 48 L(Max.) |
| 2 | Material | Types | FR-4, Aluminum/ Copper-base, Rogers | FR-4(Halogen-free), Arlon |
| 3 | Panel Size | Max | 508 x 610 mm(20” x 24”) | 508 x 1500 mm(20” x 34”) |
| 4 | Finished Thickness | Min~max | 0.2~5.0mm(0.005~0.126”) | 0.2~6.5mm(0.005~0.165”) |
| 5 | Trace Width/Space | Inner/ Outer layer | 3/3mils(0.075/0.075mm) | 2/2mils(0.05/0.05mm) |
| 6 | Mechanical Drilling | Min | 0.008”(0.20mm) | 0.006”(0.15mm) |
| 7 | Mechanical Drilling | Max | 0.197”(5.0mm) | 0.256”(6.5mm) |
| 8 | Laser Drilling | Laser drilling(min) | 0.006”(0.15mm) | 0.004”(0.10mm) |
| 9 | Aspect Ratio | Max | 12:01 | 20:01 |
| 10 | Copper Thickness | Min~max | 0.5~6 OZ | 20 OZ(max) |
| 11 | Solder Mask | Color | Glossy/Matt Green, white, black, red, blue | Yellow, pink, purple |
| 12 | Silkscreen | Color | White, black | / |
| 13 | Surface Finish | Types | HASL, Immersion Gold/ Tin/ Silver, Plating hard Gold, OSP | ENEPIG |
| 14 | Routing | Bit diameter | 0.093”, 0.062”, 0.031” | 0.021” |
| 15 | Profile | Tolerance | ±0.006”(0.15mm) | ±0.004”(0.10mm) |
| 16 | V-scoring | Angle | 30° | 20°/ 45°/ 60° |
| 17 | Plating hard Gold | Thickness | 0.032”(0.8um) typical | 0.050”(max) |
| 18 | Special Processes | / | Carbon Ink, Peelable Mask, depth controll milling | / |
Guidelines and specifications used in the electronics manufacturing industry to ensure the quality, reliability, and consistency of electronic products.
