Expert PCB Assembly Services in China – Quality, Speed, and Reliability You Can Trust.
Laser cutting stainless steel stencils, specially designed for automatic solder paste printing.
Fuji NXT III + AIMEX + XPF SMT mounter; Lead-free 12 Heating zones Nitrogen Reflow Oven.
Manual or automatic insertion, wave soldering; Post-welding; Senju solder paste.
Combine of both through-hole and surface-mount technology components on the same PCBA.
RoHS components, lead-free solder paste for safer, eco-friendly electronics.
Loading firmware, software code and configuration data into programmable ICs.
Removing and replacing the BGA component from PCBA and fix it.
A thin polymer film on the PCB for protection against moisture and harsh conditions.
Make the plastic or metal enclosure for the PCBA, use mould.
Software testing that verifies the software performs its intended functions according to requirements.
Hand or automatic soldering the high quality cables, wire harness onto the PCB.
Evaluate a system's performance over time to identify potential long-term issues.
Assembling, configuring, and testing electronic devices or systems in packaging.
Visual + AOI, X-ray inspections; ICT, FCT, Aging testing...
Assembling, configuring, and testing electronic devices or systems in packaging.
From bare PCB Manufacturing to the finished product for sale on market.
Our value-added services are designed to enhance your experience and provide additional benefits beyond our core offerings. From quality guarantees to personalized support, we are committed to going the extra mile to ensure your complete satisfaction.
Free DFM analysis to Ensure the PCB design is optimized for assembly, reducing errors and improving yield rates.
Support both Surface Mount Technology (SMT) and Through-Hole Technology (THT) for complex or hybrid PCB designs.
Expedited assembly services to meet tight deadlines, ideal for prototyping or urgent production needs.
Comprehensive end-to-end service covering PCB fabrication, component sourcing, assembly, and testing, providing a seamless experience for customers.
Check all the data provided to make sure the designing of the PCB is manufacturable, functional, reliable and cost effective. Raise questions if EQ, then issue MI for production.
Cut the materials into panel according to MI. Including core, Prepreg, copper foils. Tooling holes need to be drilled at this step.
Prepare for the inner layer DFR(Dry Film Resist) lamination. To increase DFR adhesion, etch the surface of copper foils by jet-scrubber, buffbrushing.
Laminate Dry Film on cores. D/F is used as a photosensitive material forphotolithography.
Expose light onto the D/F.LDI (Laser Direct Imaging),which doesn't require mask application,is analternative solution.
Same as the following. Developing the photoresist; Etching away unwanted copper; Stripping the remaining resist to reveal the circuit pattern.
Etch the surface of copper surface to ensure adhesion of coppe and Prepreg.
Laminate copper foils, Prepreg and black oxided cores to a single panel.
Heat the laminated layers under pressure in a vacuum melt Prepreg by heat to multilayer PCB formation. Other processes by the following will be the same as a double-sided PCB.
Drill on board to form through holes.
Remove the smear and resin residues left in the drilled holes, to ensure good electrical connectivity and improve the copper plating quality.
Remove the smear and resin residues left in the drilled holes, to ensure good electrical connectivity and improve the copper plating quality.
Electroless Copper Plating, a thin layer of copper is deposited on the hole walls through a chemical process, making them conductive.
Electroplating, the thin copper layer is further reinforced with additional copper through electroplating, ensuring robust andreliable electrical connections.
Prepare for the next step, D/F lamination. To increase dry film adhesion, etch the surface of copper foils by jet-scrubber,buff brushing.
Laminate Dry Film on copper foils. D/F is used as a photosensitive material for photolithography.
Apply masks(films) on D/F and expose light onto the surface of copper foils. Currently, we use both ways, D/Fand LDI(Laser Direct Imaging), which doesn't require mask application.
Developing the photoresist; Etching away unwanted copper; Stripping the remaining resist to reveal the circuit pattern.
Use AOI for outer layer inspection, to check for defects such as scratches, misalignments, and incomplete etching, ensuring the final board meets the required specification.
Clean and roughen the copper surface to increase the adhesion between the copper surface and solder resist.
Apply photosolder resist on one side then pre-baking, then printing solder resist on the other side, pre-baking, then exposure-develop-curing.
| No. | Item | Feature | Standard | Advanced |
|---|---|---|---|---|
|
No.
1
|
Item
Layer Count
|
Feature
Min~Max
|
Standard
1~16L
|
Advanced
48 L(Max.)
|
|
No.
2
|
Item
Material
|
Feature
Types
|
Standard
FR-4, Aluminum/ Copper-base, Rogers
|
Advanced
FR-4(Halogen-free), Arlon
|
|
No.
3
|
Item
Panel Size
|
Feature
Max
|
Standard
508 x 610 mm(20”x 24”)
|
Advanced
508 x 1500 mm(20” x 34”)
|
|
No.
4
|
Item
Finished Thickness
|
Feature
Min~max
|
Standard
0.2~5.0mm(0.005~0.126”)
|
Advanced
0.2~6.5mm(0.005~0.165”)
|
|
No.
5
|
Item
Trace Width/ Space
|
Feature
Inner/ Outer layer
|
Standard
3/3mils(0.075/0.075mm)
|
Advanced
2/2mils(0.05/0.05mm)
|
|
No.
6
|
Item
Mechanical Drilling
|
Feature
Min
|
Standard
0.008”(0.20mm)
|
Advanced
0.006”(0.15mm)
|
|
No.
7
|
Item
Mechanical Drilling
|
Feature
Max
|
Standard
0.197”(5.0mm)
|
Advanced
0.256”(6.5mm)
|
|
No.
8
|
Item
Laser Drilling
|
Feature
Min
|
Standard
0.006”(0.15mm)
|
Advanced
0.004”(0.10mm)
|
|
No.
9
|
Item
Aspect Ratio
|
Feature
Max
|
Standard
12:1
|
Advanced
20:1
|
|
No.
10
|
Item
Copper Thickness
|
Feature
Min~max
|
Standard
0.5~6 OZ
|
Advanced
20 OZ(max)
|
|
No.
11
|
Item
Solder Mask
|
Feature
Color
|
Standard
Glossy/Matt Green, white, black, red, blue
|
Advanced
Yellow, pink, purple
|
|
No.
12
|
Item
Silkscreen
|
Feature
Color
|
Standard
White, black
|
Advanced
/
|
|
No.
13
|
Item
Surface Finish
|
Feature
Types
|
Standard
HASL, Immersion Gold/ Tin/ Silver, Plating hard Gold, OSP
|
Advanced
ENEPIG
|
|
No.
14
|
Item
Routing
|
Feature
Bit diameter
|
Standard
0.093”, 0.062”, 0.031”
|
Advanced
0.021”
|
|
No.
15
|
Item
Profile
|
Feature
Tolerance
|
Standard
±0.006”(0.15mm)
|
Advanced
±0.004”(0.10mm)
|
|
No.
16
|
Item
V-scoring
|
Feature
Angle
|
Standard
30°
|
Advanced
20°/ 45°/ 60°
|
|
No.
17
|
Item
Plating Hard Gold
|
Feature
Thickness
|
Standard
0.032”(0.8um) typical
|
Advanced
0.050”(max)
|
|
No.
18
|
Item
Special Processes
|
Feature
/
|
Standard
Carbon Ink, Peelable Mask, depth controll milling
|
Advanced
/
|
Guidelines and specifications used in the electronics manufacturing industry to ensure the quality, reliability, and consistency of electronic products.
