Quickturn, prototype, small to medium volume PCB production.
PCB Layout optimization, EQ confirmation, to improve production yield and cost reduction.
As quick as 24 Hours for PCB Prototype manufacturing, small series as fast as 5~7 days.
No MOQ limit, PCB Prototype as less as one single piece. Even one piece we care.
Focus on High-Mix-Low-Volume PCB Manufacturing for more than 10 years.
Hard-to-find components sourcing; NRND components substitue; global network.
24 Hours PCB Assembly upon all components secured.
Most PCBs use copper as their primary conductor. If the copper is left unprotected after finishing, it can oxidize, making soldering difficult. An ideal surface finish would possess good solderability, a flat coplanar surface, cost-effectiveness, the ability to withstand unlimited heat cycles, and minimal health and safety concerns. There are various final finishes available, each with its own advantages and disadvantages. Different finishes are more suitable for specific applications.
OSPs are exceptionally thin organic coatings specifically formulated to preserve the solderability of copper surfaces on printed circuit boards (PCBs). These coatings work by forming a complex organo-metallic bond with the copper, which is critical for ensuring a reliable solderable finish. OSPs are particularly suitable for a range of applications, including both surface mount and through-hole assembly processes. Additionally, they offer a shelf life that supports effective long-term storage without compromising solderability, making them a practical choice for manufacturers and engineers alike.
Hot air solder level (HASL or HAL) is the process of immersing a circuit board into molten solder, immediately followed by blowing the excess molten solder out of the holes using hot air under high pressure. For the vast majority of HASL applications, the solder alloy is tin-lead. For Pb-free applications, the main alloys include tin-copper, tin-silver-copper, tin-coppernickel, and tin-copper-nickel-germanium alloys.
ENIG is a versatile surface finish consisting of a nickel layer topped with immersion gold. This configuration protects the nickel from oxidation and serves various functions, including soldering and as a bonding surface. The nickel layer acts as a diffusion barrier, preventing copper from leaching into the gold, and enhances the strength of thru holes. Gold, being a stable element that does not oxidize, ensures excellent wettability in soldering processes, contributing to the overall reliability of PCBs.
Immersion Silver (IAg) is a surface finish that forms a thin layer over copper, suitable for soldering, press-fit connections, and potentially for aluminum wire bonding. This finish protects the copper from oxidation during its shelf life and is applied using a galvanic displacement process with thicknesses ranging from 0.1 to 0.4 μm. Although the fabrication process is straightforward, the layer can tarnish when exposed post-assembly, which may lead to corrosion and functional degradation over time.
ISn is a protective layer of pure tin, applied using a galvanic displacement process. This coating safeguards the underlying copper from oxidation while ensuring excellent solderability and compliant pin connector functionality. The IPC-4554 specification mandates a minimum thickness of 1 μm to guarantee sufficient virgin tin for soldering, considering that an intermetallic layer forms over time between the tin and copper. Solderability tests and stress testing conditions are also outlined in the specification.
ENEPlG is a relatively new surface finish. This surface finish is much more expensivethan ENlG but is the only finish that is solderable without creating a brittle solderjoint and wire bondable. This is usually used in applications requiring both thesefeatures due to its costs.
Aliquet adipiscing vivamus ultrices ipsum, commodo vitae, elit nec ipsam luctus. Eget non vitae scelerisque eget sapiente libero, lorem nam quis vitae quis morbi, id consequat mauris massa.
Established in 2010, Union Circuits is well-known as a professional Printed Circuit Board manufacturer and exporter located in Shenzhen, China, dedicated to produce quick turnaround Prototype and small to medium volume PCBs. It was founded by a group of PCB experts who have decades of experience working in the PCB industry. With more than 10 years’ effort and our great valued customers support, so far for now Union Circuits own four modern factories with state-of-the-art equipment, each one focus on different market & products positioning to better serve our customer requirements. There are two Rigid PCB factories, one focus on quick turn small volume PCBs production, another for medium size orders which located in another city outside of Shenzhen with about one hour and a half driving away. One FPC factory and one PCB Assembly factory, both located in Shenzhen. We own the factories, knowledge and industry experience to act beyond your expectations, we are always striving to be the best.